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 Switched Capacitor Voltage Converters with Shutdown in SOT Packages
Features
* * * * * * * * * Charge Pumps in 6-Pin SOT-23A Package >95% Voltage Conversion Efficiency Voltage Inversion and/or Doubling Operates from +2.5V to +5.5V Up to 25mA Output Current Only Two External Capacitors Required Low Power Consumption Power-Saving Shutdown Mode TC1220 Compatible with 1.8V Logic Systems
M
TC1219/TC1220
General Description
The TC1219/TC1220 are CMOS "charge-pump" voltage converters in ultra-small 6-Pin SOT-23A packages. They invert and/or double an input voltage which can range from +2.5V to +5.5V. Conversion efficiency is typically >95%. Switching frequency is 12kHz for the TC1219, 35kHz for the TC1220. When the shutdown pin is held at a logic low, the device goes into a very low power mode of operation, consuming less than 1A of supply current. External component requirement is only two capacitors for standard voltage inverter applications. With a few additional components a positive doubler can also be built. All other circuitry, including control, oscillator, power MOSFETs are integrated on-chip. Typical supply currents are 60A (TC1219), 115A (TC1220). All devices are available in 6-pin SOT-23A surface mount packages.
Applications
* * * * * LCD Panel Bias Cellular Phones Pagers PDAs, Portable Dataloggers Battery-Powered Devices
Functional Block Diagram Device Selection Table
Part Number Package Osc. Freq. (kHz) 12 35 Operating Temp. Range -40C to +85C -40C to +85C
Negative Voltage Inverter
C+ + C1 C- VIN Input
TC1219ECH 6-Pin SOT-23A TC1220ECH 6-Pin SOT-23A
TC1219 TC1220
ON SHDN OFF
Package Type
6-Pin SOT-23A
C+ 6 SHDN 5 GND 4
OUT GND C2 +
V- Output
TC1219ECH TC1220ECH
1 OUT 2 VIN 3 C-
NOTE: 6-Pin SOT-23A is equivalent to the EIAJ SC-74
2002 Microchip Technology Inc.
DS21366B-page 1
TC1219/TC1220
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings*
Input Voltage (VIN to GND)....................... +6.0V, -0.3V Output Voltage (OUT to GND).................. -6.0V, +0.3V Current at OUT Pin..............................................50mA Short-Circuit Duration - OUT to GND ............Indefinite Power Dissipation (TA 70C) 6-Pin SOT-23A .........................................240mW Operating Temperature Range.............-40C to +85C Storage Temperature (Unbiased) .......-65C to +150C
Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
TC1219/TC1220 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: TA = -40C to +85C, VIN = +5V, C1 = C2 = 10F, (TC1219), C1 = C2 = 3.3F (TC1220), TA = 25C unless otherwise noted. Symbol IDD ISHDN VMIN VMAX FOSC VIH Parameter Supply Current Shutdown Supply Current Minimum Supply Voltage Maximum Supply Voltage Oscillator Frequency SHDN Input Logic High Min -- -- -- 2.5 -- 6 19 -- 1.5 1.8 1.5 -- -- -- 95 -- Typ 60 115 0.1 -- -- 12 35 -- -- -- -- -- 96 95 99.9 25 Max 115 325 1.0 -- 5.5 20 56.3 -- -- -- -- 0.5 -- -- -- 65 Units
A A
Device TC1219 TC1220
Test Conditions
SHDN = GND, VIN = 5V (Note 2) RLOAD = 1k RLOAD = 1k TC1219 TC1220 TC1219 TC1220 RLOAD = VIN = VMIN to 3V VIN = >3V to VMAX VIN = VMIN to VMAX VIN = VMIN to VMAX RLOAD = 1k RLOAD = TC1219/TC1220 ILOAD = 0.5mA to 25mA (Note 1)
V V kHz V
VIL PEFF VEFF ROUT
Note 1: 2:
SHDN Input Logic Low Power Efficiency Voltage Conversion Efficiency Output Resistance
V % %
Capacitor contribution is approximately 20% of the output impedance [ESR = 1/ pump frequency x capacitance]. VIN is guaranteed to be disconnected from OUT when the converter is in shutdown..
DS21366B-page 2
2002 Microchip Technology Inc.
TC1219/TC1220
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
Pin No. (6-Pin SOT-23A) 1 2 3 4 5 6
PIN FUNCTION TABLE
Symbol OUT VIN C- GND SHDN C
+
Description Inverting charge pump output. Positive power supply input. Commutation capacitor negative terminal. Ground. Shutdown input (active low). Commutation capacitor positive terminal.
2002 Microchip Technology Inc.
DS21366B-page 3
TC1219/TC1220
3.0 DETAILED DESCRIPTION
FIGURE 3-1:
The TC1219/TC1220 charge pump converters invert the voltage applied to the VIN pin. Conversion consists of a two-phase operation (Figure 3-1). During the first phase, switches S2 and S4 are opened and S1 and S3 are closed. During this time, C1 charges to the voltage on VIN and load current is supplied from C2. During the second phase, S2 and S4 are closed, and S1 and S3 are opened. This action connects C1 across C2, restoring charge to C2.
IDEAL SWITCHED CAPACITOR CHARGE PUMP
S2
S1 VIN C1
TC1219/1220
C2 S3 S4 VOUT = - (VIN)
OSC
Phase 1
DS21366B-page 4
2002 Microchip Technology Inc.
TC1219/TC1220
4.0
4.1
APPLICATIONS INFORMATION
Output Voltage Considerations
The remaining losses in the circuit are due to factor (4) above, and are shown in Equation 4-2. The output voltage ripple is given by Equation 4-3.
The TC1219/TC1220 perform voltage conversion but do not provide regulation. The output voltage will droop in a linear manner with respect to load current. The value of this equivalent output resistance is approximately 25 nominal at +25C and VIN = +5V. VOUT is approximately -5V at light loads, and droops according to the equation below: VDROP = IOUT x ROUT VOUT = - (VIN - VDROP)
EQUATION 4-2:
PLOSS(4) = [(0.5)(C1)(VIN2 - VOUT2) + (0.5) (C2)(VRIPPLE2 - 2VOUT VRIPPLE)] x fOSC
EQUATION 4-3:
VRIPPLE = [ IOUT / 2 x ( fOSC) (C2)] + 2 ( IOUT) (ESRC2)
FIGURE 4-1:
f V+
4.2
Charge Pump Efficiency
IDEAL SWITCHED CAPACITOR MODEL
The overall power efficiency of the charge pump is affected by four factors: 1. Losses from power consumed by the internal oscillator, switch drive, etc. (which vary with input voltage, temperature and oscillator frequency). I2R losses due to the on-resistance of the MOSFET switches on-board the charge pump. Charge pump capacitor losses due to effective series resistance (ESR). Losses that occur during charge transfer (from the commutation capacitor to the output capacitor) when a voltage difference between the two capacitors exists.
VOUT
C1
C2
RL
2. 3. 4.
FIGURE 4-2:
REQUIV V+ REQUIV = 1 f x C1
EQUIVALENT OUTPUT RESISTANCE
VOUT
Most of the conversion losses are due to factors (2) and (3) above. These losses are given by Equation 4-1(b).
C2
RL
EQUATION 4-1:
a) PLOSS (2, 3) = IOUT2 x ROUT b) where ROUT = [ 1 / [fOSC(C1) ] + 8RSWITCH + 4ESRC1 + ESRC2] The 1/(fOSC)(C1) term in Equation 4-1(b) is the effective output resistance of an ideal switched capacitor circuit (Figure 4-1 and Figure 4-2). The value of RSWITCH can be approximated at 0.5 for the TC1219/TC1220.
2002 Microchip Technology Inc.
DS21366B-page 5
TC1219/TC1220
4.3 Capacitor Selection 4.5 Shutdown Input
In order to maintain the lowest output resistance and output ripple voltage, it is recommended that low ESR capacitors be used. Additionally, larger values of C1 will lower the output resistance and larger values of C2 will reduce output ripple. (Equation 4-1(b) and Equation 4-3). Table 4-1 shows various values of C1 and the corresponding output resistance values @ +25C. It assumes a 0.1 ESRC1 and 2 RSWITCH. Table 4-2 shows the output voltage ripple for various values of C2. The VRIPPLE values assume 10mA output load current and 0.1 ESRC2. The TC1219/TC1220 is enabled when SHDN is high, and disabled when SHDN is low. This input cannot be allowed to float. (If SHDN is not required, see the TCM828/829 data sheet.) The SHDN input can be only driven to 0.5V above VIN to avoid significant current flows.
4.6
Voltage Inverter
TABLE 4-1:
OUTPUT RESISTANCE VS. C1 (ESR = 0.1)
TC1219 ROUT() 100 42 25 19.3 TC1220 ROUT() 45 25 19.4 17.5
The most common application for charge pump devices is the inverter (Figure 4-3). This application uses two external capacitors: C1 and C2 (plus a power supply bypass capacitor, if necessary). The output is equal to -VIN plus any voltage drops due to loading. Refer to Table 4-1 and Table 4-2 for capacitor selection.
C1 (F) 1 3.3 10 30
FIGURE 4-3:
VOLTAGE INVERTER TEST CIRCUIT
C3 + VIN
VOUT 1 OUT 6 C1+ + C1 4 + C2 RL
TABLE 4-2:
OUTPUT VOLTAGE RIPPLE VS. C2 (ESR = 0.1) IOUT 10mA
TC1219 VRIPPLE (mV) 419 128 44 16 TC1220 VRIPPLE (mV) 145 45 16 7
2
IN
TC1219 TC1220
GND
C2 (F) 1 3.3 10 30
3 C1- 5 SHDN
4.4
Input Supply Bypassing
Device TC1219 TC1220
C1 10F 3.3F
C2 10F 3.3F
C3 10F 3.3F
The VIN input should be capacitively bypassed to reduce AC impedance and minimize noise effects due to the internal switching of the device The recommended capacitor depends on the configuration of the TC1219/TC1220.
DS21366B-page 6
2002 Microchip Technology Inc.
TC1219/TC1220
4.7 Cascading Devices 4.8 Paralleling Devices
Two or more TC1219/TC1220 can be cascaded to increase output voltage (Figure 4-4). If the output is lightly loaded, it will be close to (-2 x VIN) but will droop at least by ROUT of the first device multiplied by the IQ of the second. It can be seen that the output resistance rises rapidly for multiple cascaded devices. To reduce the value of ROUT, multiple TC1219/ TC1220's can be connected in parallel (Figure 4-5). The output resistance will be reduced by a factor of N where N is the number of TC1219/TC1220. Each device will require its own pump capacitor (C1), but all devices may share one reservoir capacitor (C2). However, to preserve ripple performance the value of C2 should be scaled according to the number of paralleled TC1219/TC1220.
FIGURE 4-4:
CASCADING MULTIPLE DEVICES TO INCREASE OUTPUT VOLTAGE
... VIN 2 3 C1 + VIN 6 5 "1" SHDN 1 ... C2 + VOUT = -nVIN 4 3 2
TC1219 TC1220
C1 +
4 6 5
TC1219 TC1220
"n" SHDN C2 + 1 VOUT
FIGURE 4-5:
PARALLELING MULTIPLE DEVICES TO REDUCE OUTPUT RESISTANCE
ROUT = ROUT OF SINGLE DEVICE NUMBER OF DEVICES VIN 2 3 4 + 6 5 "1" SHDN ... VOUT = -VIN Shutdown Control + C2 1 3 ... 2 VIN
C1
TC1219 TC1220
C1 +
4
TC1219 TC1220
1 VOUT
6 "n" 5 SHDN
2002 Microchip Technology Inc.
DS21366B-page 7
TC1219/TC1220
4.9 Voltage Doubler/Inverter 4.10 Diode Protection for Heavy Loads
Another common application of the TC1219/TC1220 is shown in Figure 4-6. This circuit performs two functions in combination. C1 and C2 form the standard inverter circuit described previously. C3 and C4 plus the two diodes form the voltage doubler circuit. C1 and C3 are the pump capacitors and C2 and C4 are the reservoir capacitors. Because both sub-circuits rely on the same switches if either output is loaded, both will droop toward GND. Make sure that the total current drawn from both the outputs does not total more than 40mA. When heavy loads require the OUT pin to sink large currents being delivered by a positive source, diode protection may be needed. The OUT pin should not be allowed to be pulled above ground. This is accomplished by connecting a Schottky diode (1N5817) as shown in Figure 4-7.
4.11
Layout Considerations
As with any switching power supply circuit good layout practice is recommended. Mount components as close together as possible to minimize stray inductance and capacitance. Noise leakage into other circuitry can be minimized with the use of a large ground plane.
FIGURE 4-6:
COMBINED DOUBLER AND INVERTER
VIN D1, D2 = 1N4148
3 C1 + 4
2
TC1219 TC1220
1
D1
6 5
VOUT = -VIN C2 + D2 VOUT = (2VIN) - (VFD1) - (VFD2) C4
+ C3 Shutdown Control +
FIGURE 4-7:
HIGH V- LOAD CURRENT
GND 4
TC1219 TC1220
OUT 1
DS21366B-page 8
2002 Microchip Technology Inc.
TC1219/TC1220
5.0
Note:
TYPICAL CHARACTERISTICS
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Circuit of Figure 4-3, VIN = +5V, C1 = C2 = C3, TA = 25C unless otherwise noted.
Output Resistance vs. Supply Voltage
65 60 55 50 45 40 35 30 25 20 15 10 5 0 2.5 65 60
TC1219 Output Resistance vs. Temperature
40 35 30 25 20 VIN = 3.3V VIN = 5.0V
-20 0 20 40 60 80
TC1220 Output Current vs. Capacitance
45 VIN = 4.75V, VOUT = -4.0V
OUTPUT RESISTANCE ()
OUTPUT RESISTANCE ()
55 50 45 40 35 30 25 20
VIN = 3.15V, VOUT = -2.5V
TC1220
15 10 5 0 0 5 10 15 20 25
CAPACITANCE (F)
TC1219
3.5
4.5
5.5
15 -40
30
SUPPLY VOLTAGE (V)
TEMPERATURE (C)
TC1219 Output Voltage Ripple vs. Capacitance
OUTPUT VOLTAGE RIPPLE (mVp-p) OUTPUT VOLTAGE RIPPLE (mVp-p)
500 450 400 350 300 250 200 150 100 50 0 0 5 10 25 20 25 30 CAPACITANCE (F) VIN = 4.75V, VOUT = -4.0V
TC1220 Output Voltage Ripple vs. Capacitance
500 450 45 40
TC1219 Output Current vs. Capacitance
VIN = 4.75V, VOUT = -4.0V
OUTPUT CURRENT (mA)
400 350 300 250 200 150 100 50 0 0 5 10 15 20 25 30 CAPACITANCE (F)
35 30 25 20 15 10 5 0 0 5 10 15 20 25 30 35 40 45 50 CAPACITANCE (F)
VIN = 3.15V, VOUT = -2.5V
VIN = 4.75V, VOUT = -4.0V VIN = 3.15V, VOUT = -2.5V
VIN = 3.15V, VOUT = -2.5V
Supply Current vs. Supply Voltage
150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 2.5 15
TC1219 Pump Frequency vs. Temperature
45 PUMP FREQUENCY (kHz) PUMP FREQUENCY (kHz)
14 13 12
TC1220 Pump Frequency vs. Temperature
SUPPLY CURRENT (A)
TC1220
VIN = 5.0V
40
VIN = 5.0V
35
VIN = 3.3V
11 10 9 8 -40
VIN = 3.3V
30
TC1219
25 20 -40
4.5 3.5 SUPPLY VOLTAGE (V)
5.5
-20
0
20
40
60
80
-20
0
20
40
60
80
TEMPERATURE (C)
TEMPERATURE (C)
2002 Microchip Technology Inc.
DS21366B-page 9
TC1219/TC1220
TYPICAL CHARACTERISTICS (CONTINUED)
Output Voltage vs. Output Current
0.5 -0.5 -1.5 VIN = 3.3V -2.5 -3.5 VIN = 5.0V -4.5 -5.5 0 5 10 15 20 25 30 35 40 OUTPUT CURRENT (mA) 110 100 90 80 70 60 50 40 30 20 10 0 0 5 10 15 20 25 30 35 40 45 50 CURRENT (mA) VIN = 3.3V
Efficiency vs. Output Current
VIN = 5.0V
OUTPUT VOLTAGE (V)
EFFICIENCY (%)
DS21366B-page 10
2002 Microchip Technology Inc.
TC1219/TC1220
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
1
&
2
= part number code + temperature range (two-digit code)
Code AM AN
TC1219/TC1220 TC1219ECH TC1220ECH ex: 1219ECH = A M
3 4
represents year and quarter code represents production lot ID code
6.2
Taping Form
Component Taping Orientation for 6-Pin SOT-23A (EIAJ SC-74) Devices
User Direction of Feed
Device Marking
PIN 1 Standard Reel Component Orientation For TR Suffix Device (Mark Right Side Up)
Carrier Tape, Number of Components Per Reel and Reel Size
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
6-Pin SOT-23A
8 mm
4 mm
3000
7 in
2002 Microchip Technology Inc.
DS21366B-page 11
TC1219/TC1220
6.3 Package Dimensions
SOT-23A-6
.075 (1.90) REF.
.122 (3.10) .098 (2.50) .020 (0.50) .014 (0.35)
.069 (1.75) .059 (1.50)
.037 (0.95) REF. .118 (3.00) .110 (2.80)
.057 (1.45) .035 (0.90) .006 (0.15) .000 (0.00)
10 MAX. .024 (0.60) .004 (0.10)
.008 (0.20) .004 (0.09)
Dimensions: inches (mm)
DS21366B-page 12
2002 Microchip Technology Inc.
TC1219/TC1220
Sales and Support
Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2002 Microchip Technology Inc.
DS21366B-page13
TC1219/TC1220
NOTES:
DS21366B-page14
2002 Microchip Technology Inc.
TC1219/TC1220
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, FilterLab, KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified.
2002 Microchip Technology Inc.
DS21366B-page 15
M
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03/01/02
' ## '
DS21366B-page 16
2002 Microchip Technology Inc.


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